Contributing member is building an Open CPX module for switch and accelerator designs, using its HBxIO™ optical engine and detachable SxC™ connector.
SAN JOSE, Calif. — September 22, 2026 — Mixx Technologies, Inc., a US-based venture-backed deep-tech company building co-packaged optics for hyperscale AI infrastructure, today announced its support for the Open CPX Multi-Source Agreement (MSA) specification for co-packaged and near-package connectors and optics modules, released on September 17. Mixx is a contributing member of the Open CPX MSA, whose founding members are Ciena, Coherent, Marvell, Molex, Samtec, and TeraHop.
The specification defines an open, pluggable form factor for optics placed beside the host ASIC, at up to 7.2 Tbps per socket and 200 Gbps per lane, so that near-package and co-packaged modules can come from multiple vendors rather than a single supply chain. The industry is moving to co-packaged optics (CPO) in steps, and the step being decided now is optics inside the box, near the package. A common socket lets that step happen at volume.
Mixx is building an Open CPX module for near-package optics (NPO), using its HBxIO™ optical engine and detachable SxC™ connector. The combination has two advantages. First, placing the optics next to the host chip raises bandwidth density and radix. Higher radix means fewer switching layers, with lower latency and lower aggregate power as a result. Second, the density of the SxC™ connector, up to 24,576 fibers in a single OCP rack unit, lets a high-radix switch stay in a single rack unit (1RU), which raises rack density.
For an accelerator, the module extends scale-up connectivity beyond copper’s reach. Because the SxC™ connector is detachable, the engine and the fiber are tested separately in manufacturing and replaced separately in the field.
The HBxIO™ is the first optical engine whose fiber interface is fully integrated and tested at the wafer level. Mixx designed the HBxIO™ engine for CPO and is delivering it first in a near-package socket, so what an operator qualifies now carries forward as the optics move onto the package.
“Standards are how this industry gets from lab to fab,” said Vivek Raghuraman, CEO of Mixx Technologies. “Open CPX gives near-package optics a common socket. We designed the HBxIO™ engine for the package and we are bringing it to that socket first, with a detachable SxC™ connector, because that is the step hyperscalers are taking now.”
The Open CPX specification is available at opencpxmsa.org.
About Mixx Technologies
Mixx Technologies, Inc. is a venture-backed deep-tech company founded by the team that commercialized many zero-to-one silicon photonics products. The company is solving the data-movement bottleneck for AI compute infrastructure through its HBxIO™ platform, a multi-terabit, ultra-high-radix co-packaged optical interconnect architecture enabling cloud service providers to deploy large-scale AI inference at the speed and efficiency hyperscale demands.
Headquartered in San Jose, California, with R&D operations in India and Taiwan. Visit mixxtech.io.
