Technology

Driving AI forward with innovations that scale, optimize,
and energize the future of technology.

Empowering AI with Cutting-Edge 3DS Platform Innovations

The 3DS platform is a game-changer for AI and connectivity, enabling unprecedented performance and scalability.

Advanced Packaging Techniques

Boost interconnect scaling, optimizing data transfer for both scale-up and scale-out architectures.

Fiber Connectors

Enhance bandwidth and enable radix scaling, allowing networks to handle larger, more complex data flows with ease.

Silicon Photonics

Drives density scaling, packing more functionality into smaller spaces without sacrificing performance.

Integrated Circuit Technology

Enables power scaling, optimizing energy use to balance both performance and sustainability.

Together, these innovations in the 3DS platform deliver exceptional scalability, efficiency, and density, ready to meet the demands of today’s and tomorrow’s AI workloads. Seamlessly compatible and interoperable, this technology is designed to scale with the future of AI.

Why Choose Us?

End-to-End System-Level Integration for Seamless AI Performance

Pushing the Boundaries with 3DS Platform Integration

Unmatched Flexibility with All-to-All Connectivity

Petabit Bandwidth Connectivity for Unrivaled Speed

Lowest Power Consuming at System Level

Unparalleled Density

Scaling AI at the Highest Radix

Effortlessly Scaling Connectivity

Ensuring Maximum Yield with Test-First, ASIC-Last Integration

On-Chip Fiber Integration for Superior Efficiency

Optimized Architecture for Any AI Workload

Built for the Demands of Tomorrow’s AI Network Infrastructure

Crafted with Precision Using AI Semiconductor Flow